A040-030: One wafer, micropatterns ≥2 μm. CAD design based on customer drawings, photolithographic chromium mask, 4" Si wafer process incl. Teflon coating and chip dicing to 15x15 mm2 chips (16 total). For μ-CP 3.0 and 4.0 or your own setup.
Note: The left side is a picture of the master and the right side is a picture of the PDMS stamp that you can make using the master.